Curriculum Vitae


Ir Dr Amares Singh Gill A/L Segar Singh

  • Doctor of Philosophy (Engineering), Universiti Tunku Abdul Rahman, Malaysia
  • Master of Engineering Science, Multimedia University, Malaysia
  • Bachelor of Engineering (Honours) Mechanical, Multimedia University, -
  • Board of Engineers Malaysia (BEM), Professional Engineer, 2023 to 2023 (National)
  • Institution of Mechanical Engineers, Chartered Engineer, 2019 to 2023 (International)
  • Board of Engineers Malaysia (BEM), Graduate Member, Since 2015 (National)
  • Alloy Materials (Soldering and Surface Mount Technology, Low temperature solder alloy, Nanoparticles reinforcement)
(Course Title),(Level of Study),(Institution),(Month/Year)
  • Properties and Application of Materials, Bachelor Degree, Taylor's University (03/2022)
  • Solid Mechanics, Bachelor Degree, UCSI University (01/2022)
  • Engineering Statics, Bachelor Degree, Taylor's University (03/2022)
  • Mechanical Drawing and Assembly Technique, Bachelor Degree, UCSI University (01/2022)
  • Engineering Drawing and CAD, Bachelor Degree, Universiti Tunku Abdul Rahman (UTAR) (07/2021)
  • Introduction to Railway Engineering and System Management, Bachelor Degree, Universiti Tunku Abdul Rahman (UTAR) (10/2021)
  • Solid Mechanics, Bachelor Degree, Segi University (02/2018)
  • Vibrations, Bachelor Degree, Segi University (02/2017)
  • Integrated Design Project, Bachelor Degree, Segi University (02/2015)
  • Mechanics of Deformable Solids, Bachelor Degree, Segi University (01/2015)
(Title of publication in APA style)
Book Chapter
  • Shamini Janasekaran, Anas Zeyad Yousef, Amares Singh, Nashrah Hani Jamadon
Article in Journals
  • Michelle Mei Kit Leong and S Amares (SCOPUS-Indexed)
  • WH Chio, S Amares (SCOPUS-Indexed)
  • Amares S. G Tan W. H., Cheng E. M., Lim E., Tan W. C (SCOPUS-Indexed)
  • N Pragadish, Elango Natarajan, M Selvam, Amares Singh, N Saravanakumar (SCOPUS-Indexed)
  • Singh, A., Durairaj, R., Kumar, K. G., & Kuan, S. H. (2022, February). Impact of 3% Molybdenum (Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint. In IOP Conference Series: Materials Science and Engineering (Vol. 1225, No. 1, p. 012029). IOP Publishing. (SCOPUS-Indexed)
  • Amares Singh, Teow Sinn Khai, Rajkumar Durairaj, Amer Ahmed Qassem Saleh (2022). Preliminary Investigation of Copper Joints Soldered with Sn58Bi, Journal of Harbin Institute of Technology (New Series), 29(1), 57-63. (SCOPUS-Indexed)
  • Janasekaran, S., Lei, Z., Jun, T. R., Yunn, L. J., & Singh, A. (2022). Green Composites Reinforced with Natural Fibers: A Review on Mechanical Properties. Advanced Maritime Technologies and Applications, 1-9. (SCOPUS-Indexed)
  • Amares, S., Durairaj, R., & Kuan, S. H. (2021). Experimental study on the melting temperature, microstructural and improved mechanical properties of Sn58Bi/Cu solder alloy reinforced with 1%, 2% and 3% zirconia (ZrO2) nanoparticles. Archives of Metallurgy and Materials, 66. (ISI-Indexed)
  • Tan, W. H., Amares, S., Faridah, W., & Heng, W. K. (2021). Analysis of Noise Level and Sound Transmission Loss of Noise Barrier Material for the Construction Site. International Journal of Integrated Engineering, 13(4), 151-162. (SCOPUS-Indexed)
  • Singh, A., Durairaj, R., & How, K. S. (2021). Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 77(1), 69-87. (SCOPUS-Indexed)
  • Amares, S., & Rajkumar, D. (2020, July). Environmental Friendly Low Mass 20g-Sn58Bi/Cu Solder Alloy as an Alternative to Lead SnPb and Its Properties Study. In IOP Conference Series: Earth and Environmental Science (Vol. 505, No. 1, p. 012004). IOP Publishing. (SCOPUS-Indexed)
  • Singh, A., & Durairaj, R. (2020, April). Study on Hardness and Shear Strength with Microstructure Properties of Sn52Bi/Cu+ 1% Al2O3 Nanoparticles. In IOP Conference Series: Materials Science and Engineering (Vol. 834, No. 1, p. 012075). IOP Publishing. (SCOPUS-Indexed)
  • Amares, S., & Tchari, B. (2020). Effect on shear strength and hardness properties of tin based solder alloy, Sn-50Bi, Sn-50Bi+ 2% TiO2 nanoparticles. In Advanced Materials Research (Vol. 1159, pp. 54-59). Trans Tech Publications Ltd.
  • Singh, A., Durairaj, R., Lee, K. C., & Sia, Y. Y. (2018). Reliability study of lead free Sn-3.8 Ag-0.7 Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties. Journal of Mechanical Engineering (JMechE), (2), 169-180. (SCOPUS-Indexed)
  • Singh, A., & Durairaj, R. (2018). Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8 Ag-0.7 Cu (SAC)/Copper (Cu) solder joint. In MATEC Web of Conferences (Vol. 237, p. 02013). EDP Sciences. (SCOPUS-Indexed)
  • Amares, S., Sujatmika, E., Hong, T. W., Durairaj, R., & Hamid, H. S. H. B. (2017, October). A review: characteristics of noise absorption material. In Journal of Physics: Conference Series (Vol. 908, No. 1, p. 012005). IOP Publishing. (SCOPUS-Indexed)
  • Amares, S., Efzan, M. E., Durairaj, R., & Niakan, A. (2017, June). Influence of Nano-3% Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy. In IOP Conference Series: Materials Science and Engineering (Vol. 205, No. 1, p. 012002). IOP Publishing. (SCOPUS-Indexed)
  • Singh, A., & Noor, E. E. M. (2015). A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8 Ag-0.7 Cu (SAC) Solder Alloy. In MATEC Web of Conferences (Vol. 27, p. 02003). EDP Sciences. (SCOPUS-Indexed)
  • Noor, E. E. M., & Singh, A. (2014). Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Soldering & Surface Mount Technology, 26(3), 147-161. (ISI-Indexed)
  • Amares, S., Ervina Efzan, M. N., & Yap, T. C. (2014). Characterizations of physical properties of Sn-Bi solder alloy. In Advanced Materials Research (Vol. 845, pp. 261-265). Trans Tech Publications Ltd. (SCOPUS-Indexed)
  • Noor, E. E. M., Singh, A., & Chuan, Y. T. (2013). A review: influence of nano particles reinforced on solder alloy. Soldering & Surface Mount Technology. (ISI-Indexed)
Article in Proceeding
  • Singh, A., Durairaj, R., Natarajan, E., Tan, WH., Janasekaran, S. (2023). Thermal, Microstructure, and Hardness Properties of Molybdenum Nanoparticles Added Tin -Bismuth Solder Alloy for Low-Temperature Soldering Application. Materials, Design and Manufacturing for Sustainable Environment. Lecture Notes in Mechanical Engineering. Springer, Singapore. (SCOPUS-Indexed)
(Project title),(Role),(Duration),(Level)
  • Heat Source Modelling and Grain Size Algorithm for Directed Energy Deposition Additive Manufacturing on Thick Wall Structure , Co-researcher, 2021 to 2024 (National)
(Title of Thesis),(Name of Candidates),(Academic Level),(Role)
  • GUO JIANYONG  (Co-supervisor (Internal))
  • ZHENG HONGZE  (Co-supervisor (Internal))
(Name of Award/Stewardship),(Award Category),(Awarding Institution),(Year Awarded),(Type of Award)
  • Best Research Paper Award, Conference, Panjab University, India, 2021 (Best Paper Award)
  • Highly Commended Paper, Special, Emerald Group Publishing, 2014 (Highly Commended Paper)