Ir Dr Amares Singh Gill A/L Segar Singh


Academic Qualification

  • Doctor of Philosophy (Engineering), Universiti Tunku Abdul Rahman, Malaysia
  • Master of Engineering Science, Multimedia University, Malaysia
  • Bachelor of Engineering (Honours) Mechanical, Multimedia University, -

Professional Qualification

No records found

Areas of Expertise

  • Engineering Sciences, Materials Engineering And Metallurgy, Alloy Materials

Research Interest

No records found

Publications

2023
  • Finite Element Analysis of Sn-58Bi Shear Test (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
  • Development of a low-cost non-destructive test system for measurement of elastic modulus (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
  • Review: Current Trends in Artificial Intelligence on Healthcare - Book Chapter
2022
  • Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application (SCOPUS-Indexed) - Article in Proceeding
  • Acoustical and simulation analysis on the resonator muffler. (SCOPUS-Indexed), ARPN Journal of Engineering and Applied Sciences - Article in Journals
  • Electric Discharge Drilling of Ti-6Al-4 V with O2 as Dielectric Medium (SCOPUS-Indexed), Lecture Notes In Mechanical Engineering - Article in Journals
  • Impact of 3% Molybdenum (Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
  • Preliminary Investigation of Copper Joints Soldered with Sn58Bi (SCOPUS-Indexed), Journal of Harbin Institute of Technology (New Series) - Article in Journals
2021
  • Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles (ISI-Indexed), Archives of Metallurgy and Materials - Article in Journals
  • Analysis of Noise Level and Sound Transmission Loss (STL) of Noise Barrier Material for the Construction Site (SCOPUS-Indexed), International Journal of Integrated Engineering - Article in Journals
  • Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy (SCOPUS-Indexed), Journal of Advanced Research in Fluid Mechanics and Thermal Sciences - Article in Journals
2020
  • Environmental Friendly Low Mass 20g-Sn58Bi/Cu Solder Alloy as an Alternative to Lead SnPb and Its Properties Study (SCOPUS-Indexed), IOP Conference Series: Earth and Environmental Science - Article in Journals
  • Study on Hardness and Shear Strength with Microstructure Properties of Sn52Bi/Cu+ 1% Al2O3 Nanoparticles (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
  • Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO2 Nanoparticles, Advanced Materials Research - Article in Journals
2018
  • Reliability study of lead free Sn-3.8 Ag-0.7 Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties (SCOPUS-Indexed), Journal of Mechanical Engineering - Article in Journals
  • Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8 Ag-0.7 Cu (SAC)/Copper (Cu) solder joint (SCOPUS-Indexed), MATEC Web of Conferences - Article in Journals
2017
  • A review: characteristics of noise absorption material (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
  • Influence of Nano-3% Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
2015
  • A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8 Ag-0.7 Cu (SAC) Solder Alloy (SCOPUS-Indexed), MATEC Web of Conferences - Article in Journals
2014
  • Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys (ISI-Indexed), Soldering & Surface Mount Technology - Article in Journals
  • Characterizations of Physical Properties of Sn-Bi Solder Alloy (SCOPUS-Indexed), Advanced Materials Research - Article in Journals
2013
  • A review: influence of nano particles reinforced on solder alloy (ISI-Indexed), Soldering & Surface Mount Technology - Article in Journals

Research

  • Heat Source Modelling and Grain Size Algorithm for Directed Energy Deposition Additive Manufacturing on Thick Wall Structure ,  Co-researcher2021 to 2024, National

Awards and Stewardship

  • Best Research Paper Award, Conference, Panjab University, India, Best Paper Award , 2021
  • Highly Commended Paper, Special, Emerald Group Publishing, Highly Commended Paper , 2014

Paper Presented

  • Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application , 2nd International Conference on Material, Design and Manufacturing for Sustainable Environment (ICMDMSE) 2022 (CONFERENCE), ORAL PRESENTER , 11/03/2022 to 12/03/2022
  • Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application, 2nd International Conference on Materials, Design and Manufacturing for Sustainable Environment (ICMDMSE 2022) (CONFERENCE), ORAL PRESENTER , 11/03/2022 to 12/03/2022
  • Initial Study on the Effect of the 1% and 2% TiO 2 Nanoparticles to the Microhardness, Microstructure and Contact Angle of the SnBi/Cu Solder Alloy, 4th International Conference on Multi-Disciplinary Research Studies and Education (ICMDRSE-2021) (CONFERENCE), ORAL PRESENTER , 29/06/2021 to 30/06/2021
  • Impact of 3% Molybdenum(Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint., International Conference on Multidisciplinary Aspects of Material in Engineering (IC-MAME2021) (CONFERENCE), ORAL PRESENTER , 08/10/2021 to 09/10/2021
  • Study on hardness and shear strength with microstructure properties of Sn52Bi/Cu + 1% Al2O3 nanoparticles., 6th International Conference on Advances in Mechanical Engineering (ICAME 2019) (CONFERENCE), ORAL PRESENTER , 14/08/2019 to 16/08/2019
  • A Study on the Shear Strength, Contact Angle and Melting Temperature of Sn58Bi/Cu Joint at Low Temperature (, The International Conference on Advances in Manufacturing and Laser Processing Technology (AMLPT2019) (CONFERENCE), ORAL PRESENTER , 25/09/2019 to 26/09/2019
  • Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint., 2018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018) (CONFERENCE), ORAL PRESENTER , 27/09/2018 to 29/09/2018
  • Influence of nano-3%Al2O3 on the properties of low temperature Sn-58Bi (SB) lead-free solder alloy, 2017 2nd International Conference on Materials Engineering and Nanotechnology (ICMEN 2017) (CONFERENCE), ORAL PRESENTER , 12/05/2017 to 14/05/2017
  • Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties, 5th International Conference on Advances in Mechanical Engineering 2017 (ICAME2017) (CONFERENCE), ORAL PRESENTER , 16/08/2017 to 18/08/2017
  • A Review: Characteristics of Noise Absorption Material, International Conference on Applications and Design in Mechanical Engineering (ICADME 2017) (CONFERENCE), ORAL PRESENTER , 21/08/2017 to 22/08/2017