Senior Lecturer II
- School of Engineering
Faculty of Innovation & Technology - amares.singh@taylors.edu.my
Ir Dr Amares Singh Gill A/L Segar Singh
Academic Qualification
- Doctor of Philosophy (Engineering), Universiti Tunku Abdul Rahman, Malaysia
- Master of Engineering Science, Multimedia University, Malaysia
- Bachelor of Engineering (Honours) Mechanical, Multimedia University, -
Professional Qualification
No records found
Areas of Expertise
- Engineering Sciences, Materials Engineering And Metallurgy, Alloy Materials
Research Interest
No records found
Publications
2023
- Review: Current Trends in Artificial Intelligence on Healthcare - Book Chapter
- Finite Element Analysis of Sn-58Bi Shear Test (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
- Development of a low-cost non-destructive test system for measurement of elastic modulus (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
2022
- Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application (SCOPUS-Indexed) - Article in Proceeding
- Preliminary Investigation of Copper Joints Soldered with Sn58Bi (SCOPUS-Indexed), Journal of Harbin Institute of Technology (New Series) - Article in Journals
- Green Composites Reinforced with Natural Fibers: A Review on Mechanical Properties (SCOPUS-Indexed), Advanced Maritime Technologies and Applications - Article in Journals
- Impact of 3% Molybdenum (Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
- Acoustical and simulation analysis on the resonator muffler. (SCOPUS-Indexed), ARPN Journal of Engineering and Applied Sciences - Article in Journals
2021
- Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles (ISI-Indexed), Archives of Metallurgy and Materials - Article in Journals
- Analysis of Noise Level and Sound Transmission Loss (STL) of Noise Barrier Material for the Construction Site (SCOPUS-Indexed), International Journal of Integrated Engineering - Article in Journals
- Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy (SCOPUS-Indexed), Journal of Advanced Research in Fluid Mechanics and Thermal Sciences - Article in Journals
2020
- Environmental Friendly Low Mass 20g-Sn58Bi/Cu Solder Alloy as an Alternative to Lead SnPb and Its Properties Study (SCOPUS-Indexed), IOP Conference Series: Earth and Environmental Science - Article in Journals
- Study on Hardness and Shear Strength with Microstructure Properties of Sn52Bi/Cu+ 1% Al2O3 Nanoparticles (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
- Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO2 Nanoparticles, Advanced Materials Research - Article in Journals
2018
- Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8 Ag-0.7 Cu (SAC)/Copper (Cu) solder joint (SCOPUS-Indexed), MATEC Web of Conferences - Article in Journals
- Reliability study of lead free Sn-3.8 Ag-0.7 Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties (SCOPUS-Indexed), Journal of Mechanical Engineering - Article in Journals
2017
- Influence of Nano-3% Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy (SCOPUS-Indexed), IOP Conference Series: Materials Science and Engineering - Article in Journals
- A review: characteristics of noise absorption material (SCOPUS-Indexed), Journal of Physics: Conference Series - Article in Journals
2015
- A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8 Ag-0.7 Cu (SAC) Solder Alloy (SCOPUS-Indexed), MATEC Web of Conferences - Article in Journals
2014
- Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys (ISI-Indexed), Soldering & Surface Mount Technology - Article in Journals
- Characterizations of Physical Properties of Sn-Bi Solder Alloy (SCOPUS-Indexed), Advanced Materials Research - Article in Journals
2013
- A review: influence of nano particles reinforced on solder alloy (ISI-Indexed), Soldering & Surface Mount Technology - Article in Journals
Research
- Heat Source Modelling and Grain Size Algorithm for Directed Energy Deposition Additive Manufacturing on Thick Wall Structure , Co-researcher, 2021 to 2024, National
Awards and Stewardship
- International Innovation Awards, Exhibition/Invention, Protemp Exhibitions Sdn Bhd, Silver Award , 2024
- Asian Youth Innovation Award, Exhibition/Invention, Protemp Exhibitions Sdn Bhd, Gold , 2023
- Best Research Paper Award, Conference, Panjab University, India, Best Paper Award , 2021
- Highly Commended Paper, Special, Emerald Group Publishing, Highly Commended Paper , 2014
Paper Presented
- Investigation on the thermal and wettability properties aided with mechanical test simulation of tin (Sn) bismuth (Bi) solder alloy at low reflow temperatures , International Conference on Future Trends in Welding, Joining and Additive Manufacturing 2023. (CONFERENCE), ORAL PRESENTER , 24/08/2023 to 24/08/2023
- Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application, 2nd International Conference on Material, Design and Manufacturing for Sustainable Environment (ICMDMSE) 2022 (CONFERENCE), ORAL PRESENTER , 11/03/2022
- Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application , 2nd International Conference on Material, Design and Manufacturing for Sustainable Environment (ICMDMSE) 2022 (CONFERENCE), ORAL PRESENTER , 11/03/2022 to 12/03/2022
- Thermal, Microstructure and Hardness Properties of Molybdenum Nanoparticles added Tin -Bismuth Solder Alloy for Low Temperature Soldering Application, 2nd International Conference on Materials, Design and Manufacturing for Sustainable Environment (ICMDMSE 2022) (CONFERENCE), ORAL PRESENTER , 11/03/2022 to 12/03/2022
- Initial Study on the Effect of the 1% and 2% TiO 2 Nanoparticles to the Microhardness, Microstructure and Contact Angle of the SnBi/Cu Solder Alloy, 4th International Conference on Multi-Disciplinary Research Studies and Education (ICMDRSE-2021) (CONFERENCE), ORAL PRESENTER , 29/06/2021 to 30/06/2021
- Impact of 3% Molybdenum(Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint., International Conference on Multidisciplinary Aspects of Material in Engineering (IC-MAME2021) (CONFERENCE), ORAL PRESENTER , 08/10/2021 to 09/10/2021
- Study on hardness and shear strength with microstructure properties of Sn52Bi/Cu + 1% Al2O3 nanoparticles., 6th International Conference on Advances in Mechanical Engineering (ICAME 2019) (CONFERENCE), ORAL PRESENTER , 14/08/2019 to 16/08/2019
- A Study on the Shear Strength, Contact Angle and Melting Temperature of Sn58Bi/Cu Joint at Low Temperature (, The International Conference on Advances in Manufacturing and Laser Processing Technology (AMLPT2019) (CONFERENCE), ORAL PRESENTER , 25/09/2019 to 26/09/2019
- Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint., 2018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018) (CONFERENCE), ORAL PRESENTER , 27/09/2018 to 29/09/2018
- Influence of nano-3%Al2O3 on the properties of low temperature Sn-58Bi (SB) lead-free solder alloy, 2017 2nd International Conference on Materials Engineering and Nanotechnology (ICMEN 2017) (CONFERENCE), ORAL PRESENTER , 12/05/2017 to 14/05/2017